Universitäre Service-Einrichtung für Transmissionselektronenmikroskopie
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8th floor:

Location: DB08E03
Tel.: 45211, 45214
Person of responsibility: Mr. Jakob Gruber

7th floor:

Location: DB07E03
Tel.: 13778

Ion Mills

Low-voltage ion mill

Gentlemill

Application area:

  • final thinning of FIB prepared TEM-lamellae
  • final thinning of PIPS prepared specimens

Producer: TechnoorgLinda
Operation voltage: 500 V - 1000 V
Filament: Tungsten hot cathode (Omega-Kathode)
Vacuum: 1 membrane pump, 1 turbo molecular pump (oil free)

PIPS with attached video camera

Precision Ion Polishing System (PIPS)

Application area:

  • ion milling of mechanically prepared specimens
  • ion milling of electro polished specimens

Producer: GATAN Inc.

Operation voltage: 2000 V - 5000 V
Vacuum: 1 membrane pump, 1 turbo molecular pump (oil free)

Precision cut-off and grinding

Automatic cut-off machine

Accutom 50

Application area:

  • Automatic cut-off and grinding
  • Cut-off of samples for TEM-preparation
  • Grinding of samples for TEM/SEM-sample preparation

Producer: Struers

Variable wheel speed of 300 rpm - 5000 rpm
Feed speed:  0.005 mm/s -3.000 mm/s
Position accuracy: 5 µm
Al2O3 and diamond cut-off wheels
Diamond cup wheels for hard, brittle and ductile materials (91 µm, 40 µm)

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Wire saw

Wire saw

A wire saw produces very fine slices from a material with just small stress to the sample.  This procedure is applied to brittle materials, but also for cross section preparartions.

Cooling the electrolyte with liquid Nitrogen (-195°C)

Electrolytic thinning

TenuPol-5

Application area:

  • electrolytic thinning of TEM samples
  • automatic shut-off through infra-red sensor

Producer: Struers


Controlled operation temperature down to -30°C  with cooling unit.

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Dimple grinder for precision sample thinning.

Grinding / Polishing

TEM samples as well as EBSD samples need to be thinned and polished carefully using SiC or diamond foils and polish cloths.

Special tools allow to mechanically grind parallel surfaces or wedge shaped samples. Additionally ultrasonic sample drills, sample punches or dimple grinder are available.

Metprep4
Fluid Dispenser
Multiprep

MetPrep4 Grinding/Polishing machine with Powerhead4

Producer: Allied

Application area:

  • Semi-automatic grinding and polishing of samples for electron microscopy

Specifications :

  • Programmable up to 25 polishing steps
  • Variable platen and jog speed, 40-600 rpm
  • Various platens for different samples
  • Magnetic platen for quick cloths changing
  • Up to 4 samples at the same time

 

AD-5 Fluid Dispenser

 Producer: Allied

Application area:

  • Automatic, unattended application of abrasive polishing suspensions or lubricants.

 Specifications:

  • 5 dispensing positions
  • Up to 25 programmable menus
  • Remote function allows seamless integration and automatic activation with MetPrep

 

 

Multiprep System

Producer: Allied

Application area :

  • Precise semi-automatic sample preparation of a wide range of materials for SEM, FIB, TEM

Specifications :

  • Front digital indicator displays real-time material removal (sample advancement)
  • Variable platen speed: 5-350 rpm
  • Various sample holders for different sample shapes and preparation methods
  • Various platens for different samples
  • Magnetic platen for quick cloths changing

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Plasmacleaner with sample holder loaded in operation

Plasmacleaner

Producer: Gala

A Plasmacleaner can be used for carefully cleaning TEM samples in order to avoid contamination (especially carbon) during TEM experiments.

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Ultramicrotomy

Ultramicrotome in operation

Sample embedded in resin can be cut with an ultramicrotome to slices with a thickness of 50 nm to 100 nm.  The slices are placed on a support grid and can be investigated in a TEM without any further preparation steps.

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Sputter Coater Quorum Q150T S

Quorum Q150T S Sputter Coater

Producer: Quorum

Application area:

  • Metal sputtering of insulator samples for SEM and TEM
  • manufacturing of electron absorbing layers for holography apertures

Specifications:

  • Cr- and Au/Pd-Targets
  • Ir- and Os-Targets for high-resolution and/or chemical micro-analysis
  • C-Target for EBSD, EDX without conducting metal layer, manufaturing of TEM-films
  • High vacuum fine grain sputtering
  • Rotaing and tilting sample stage
  • Thickness monitor control

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TEM lamella for lift-out
3D preparation of a wood sample

TEM lamella preparation

Site specifc TEM lamella can be prepared with H-bar or lift-out technique using the DualBeam-FIB Quanta 200 3D.  For lift-out nanomanipulators can be used in the FIB.

 

 

 

 

 

3D preparation

The gallium ion-beam allows to uncover sample areas in order to get a 3D information of the sample.  Consecutive "slice and view" leads to 3D-images of the material.

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